More complex electronic and computing devices call for smaller and faster semiconductors, which means scientists around the world are working with new materials on the nanoscale to achieve the design goals for next-generation technology. To this end, an international team of researchers led by New York University Tandon School of Engineering Professor of Chemical and Biomolecular Engineering Elisa Riedo has made a breakthrough in fabricating atom-thin processors using a new method for fabricating metals that scientists believe can replace silicon for next-generation chips.
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